NF C96-013-6-17*NF EN 60191-6-17:2012
半导体器件的机械标准化 第6-17部分：表面安装的半导体器件封装外形图绘制的一般规则 层叠封装的设计指南 细间距球栅阵列和细间距基板栅格阵列（P-PFBGA和P-PFLGA）
Mechanical standardization of semiconductor devices - Part 6-17 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land g