PURPOSE The purpose of this standard is to evaluate electromechanical surface-mountable components which have been subjected to the environmental effects of machine soldering using an infrared system. This standard shall not be construed as a production procedure in machine soldering operations. The solderability determination is made on the basis of an effective bond between the component terminals and the printed wiring board. The acceptable performance of a component subjected to this test is determined by visual examination and those tests specified to be performed upon completion of the test. This test deals with infrared soldering and cleaning operations only@ and does not consider additional factors in the assembly of surface mounted devices such as oven drying of soldering pastes.