This Sectional Specification relates to the sockets for Multi-Package Modules of assessed qualtty. The purpose of this Specification is to provide a means of assuring interchange-ability between devices and compatibilrty between the board and the socket for the multipackage module socket and to provide standardized test methods@ gauges and performance requirements.
EIA-540F000-1991由ECIA - Electronic Components Industry Association 发布于 1991-11-01,并于 2015-01-14 实施。
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