IEC 61760-2-2007
表面安装技术.第2部分:表面安装器件(SMD)的运输和存储条件.使用指南

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

标准号

IEC 61760-2-2007

发布日期

2007年04月

实施日期

废止日期

无

中国标准分类号

L10

国际标准分类号

31.020

发布单位

IX-IEC

引用标准

IEC 60286-3 IEC 60286-4 IEC 60286-5 IEC 60286-6 IEC 60721-3-1

被代替标准

IEC 91/569/CDV-2005 IEC 61760-2-1998

适用范围

This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".

IEC 61760-2-2007系列标准

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