NF C96-013-6-2-2002 半导体器件的机械标准化.第6-2部分:半导体器件包装用表面安装略图制备的一般规则.1.5 mm 、1.27 mm 和 1.00 mm 螺距球面和柱状终端包的设计指南
Mechnical standardization of semiconductor devices - Part 6-2 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages.