IEC PAS 62588:2008
鉴别有铅(PB)、无铅和其它属性的元件、印制电路板(PCBs)和印制电路板组件(PCBAs)的标记和标注
Marking and labeling of components, PCBs and PCBAs to identify lead (PB), Pb-free and other attributes
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- 标准号
- IEC PAS 62588:2008
- 发布
- 2008年
- 发布单位
- 国际电工委员会
- 当前最新
- IEC PAS 62588:2008
- 引用标准
- ANSI 17-1981 Directive 61249-2-21 IEC 61249-2-21 IPC-4101 IPC-CC-830 IPC-T-50 JESD88
- 被代替标准
- JESD97:2004 IPC-1066:2005
- 适用范围
- This document applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes. This document describes the marking of components and the labeling of their shipping containers to identify their 2na level terminal finish or material, and applies to components that are intended to be attached to boards or assemblies with solder or mechanical clamping or are press fit. This document also applies to 2nd level terminal materials for bumped die that are used for direct board attach. This document applies to boards/assemblies, to identify the type of Pb-free or Pb-containing solder used. This document documents a method for identifying board surface finishes and Printed Circuit Board (PCB) resin systems. This docu- ment applies to PCB base materials and for marking the type of conformal coating utilized on Printed Circuit Board Assemblies (PCBAs). Material and their containers previ- ously marked or labeled according to JESD 97 or IPC-1066 need not be remarked unless agreed upon by the supplier and customer. Labeling of exterior surfaces of finished articles, such as computers, printers, servers, and the like, is outside the scope of this document. However internal PCBs and PCBAs are covered by this document. Labeling of retail packages containing electronic products is also outside the scope of this document.