KS C IEC 61249-2-13-2003 印刷电路板和其他互联结构用材料.第2-13部分:包覆和非包覆增强基底材料分规范装置、限定可燃性的铜包被的非编织的芳香聚酰胺层状氰酯
Materials for printed boards and other interconnecting structure-Part 2-13:Sectional specification set for reinforced base materials,clad and unclad-Cyanate ester non-woven aramid laminate of defined flammability, copper-clad