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gold paste

gold paste, Total:23 items.

In the international standard classification, gold paste involves: Non-ferrous metals, Products of non-ferrous metals, Plastics, Testing of metals.

SAE - SAE International, gold paste

• SAE AMS3430A-1983 BRAZING FILLER METAL@ PASTE@ COPPER Water Thinning

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, gold paste

• GB/T 17472-1998 Specification for pastes of precious metals
• GB/T 17472-2008 Specification for pastes of precious metal used for microelectronics
• GB/T 17472-2022 Specification for pastes of precious metal used for microelectronics
• GB/T 17473.2-2008 Test method of precious metals pastes used for microelectronics.Determination of fineness
• GB/T 17473.3-2008 Test method of precious metals pastes used for microelectronics.Determination of sheet resistance
• GB/T 17473.5-2008 Test method of precious metals pastes used for microelectronics.Determination of viscosity
• GB/T 17473.4-2008 Test methods of precious metals pastes used for microelectronics.Determination of adhesion
• GB/T 17473.6-2008 Test method of precious metals pastes used for microelectronics.Determination of resolution
• GB/T 17473.2-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of fineness
• GB/T 17473.3-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of sheet resistance
• GB/T 17473.1-2008 Test method of precious metals pastes used for microelectronics.Determination of solids content
• GB/T 17473.5-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of viscosity
• GB/T 17473.6-1998 Test methods of precious metal pastes used for thick-film microelectronics--Determination of resolution
• GB/T 17473.4-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of adhesion
• GB/T 17473.1-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of solids content
• GB/T 17473.7-2008 Test method of precious metals pastes used for microelectronics.Determination of solderability and solderelaching resistance
• GB/T 17473.7-1998 Test methods of precious metal pastes used for thick-film microelectronics--Test of solderability and solderleaching resistance

Society of Automotive Engineers (SAE), gold paste

• SAE AMS3430B-1994 BRAZING FILLER METAL, PASTE, COPPER Water Thinning

Military Standard of the People's Republic of China-General Armament Department, gold paste

• GJB 5273-2003 Thick Film Gold Conductor Paste Specification
• GJB 10068-2021 Specification for thick film gold-based conductor pastes

Group Standards of the People's Republic of China, gold paste

• T/CEMIA 022-2019 Gold conductor paste for multilayer wiring

Professional Standard - Non-ferrous Metal, gold paste

• YS/T 604-2006 Gold based thick film conductor pastes

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