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Microcavity device

Microcavity device, Total:500 items.

In the international standard classification, Microcavity device involves: Laboratory medicine, Analytical chemistry, Medical equipment, Aircraft and space vehicles in general, Semiconductor devices, Dentistry, Aerospace fluid systems and components, Electrical accessories, Electromechanical components for electronic and telecommunications equipment, Fibre optic communications, Piezoelectric and dielectric devices, Testing of metals, Aerospace engines and propulsion systems, Photography, Valves, Integrated circuits. Microelectronics, Capacitors, Electricity. Magnetism. Electrical and magnetic measurements, Microprocessor systems, Metrology and measurement in general, Vocabularies, Electronic components in general, Optical equipment, Characteristics and design of machines, apparatus, equipment, Electronic tubes, Ventilators. Fans. Air-conditioners, Air quality, Equipment for the chemical industry, Equipment for petroleum and natural gas industries, Electrical engineering in general, Insulating fluids, Components and accessories for telecommunications equipment, Transport, Rotating machinery, Magnetic materials, Components for electrical equipment, Document imaging applications, Radiocommunications, Cinematography, Interface and interconnection equipment, Products of non-ferrous metals, Hydraulic energy engineering, Microbiology.

British Standards Institution (BSI), Microcavity device

BS 748:1982 Specification for haemacytometer and particle counting chambers
BS IEC 62047-33:2019 Semiconductor devices. Micro-electromechanical devices - MEMS piezoresistive pressure-sensitive device
BS EN 60127-6:1994 Miniature fuses - Fuse-holders for miniature cartridge fuse-links
BS EN 60127-6:2014 Miniature fuses. Fuse-holders for miniature fuse-links
BS EN 62148-15:2014 Fibre optic active components and devices. Package and interface standards. Discrete vertical cavity surface emitting laser packages
BS EN 62148-15:2010 Fibre optic active components and devices - Package and interface standards - Discrete vertical cavity surface emitting laser packages
BS IEC 60747-4:2007+A1:2017 Semiconductor devices. Discrete devices - Microwave diodes and transistors
BS EN 60747-16-1:2002+A1:2007 Semiconductor devices — Part 16-1: Microwave integrated circuits — Amplifiers
BS EN 60747-16-5:2013+A1:2020 Semiconductor devices - Microwave integrated circuits. Oscillators
BS EN 60747-16-3:2002+A2:2017 Semiconductor devices - Microwave integrated circuits. Frequency converters
BS EN 60747-16-1:2002+A2:2017 Semiconductor devices - Microwave integrated circuits. Amplifiers
BS EN IEC 60747-16-6:2019 Semiconductor devices. Microwave integrated circuits. Frequency multipliers
BS IEC 62047-34:2019 Semiconductor devices. Micro-electromechanical devices - Test methods for MEMS piezoresistive pressure-sensitive device on wafer
BS IEC 62047-32:2019 Semiconductor devices. Micro-electromechanical devices - Test method for the nonlinear vibration of MEMS resonators
BS IEC 62047-41:2021 Semiconductor devices. Micro-electromechanical devices. RF MEMS circulators and isolators
BS EN IEC 62148-15:2021 Fibre optic active components and devices. Package and interface standards. Discrete vertical cavity surface emitting laser packages
BS EN 60747-16-4:2004+A2:2017 Semiconductor devices - Microwave integrated circuits. Switches
BS IEC 60747-16-2:2001 Semiconductor devices. Microwave integrated circuits. Frequency prescalers
BS IEC 62047-37:2020 Semiconductor devices. Micro-electromechanical devices - Environmental test methods of MEMS piezoelectric thin films for sensor application
BS EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
BS IEC 62047-35:2019 Semiconductor devices. Micro-electromechanical devices - Test method of electrical characteristics under bending deformation for flexible electromechanical devices
BS EN 62047-20:2014 Semiconductor devices. Micro-electromechanical devices. Gyroscopes
BS IEC 62047-28:2017 Semiconductor devices. Micro-electromechanical devices - Performance testing method of vibration-driven MEMS electret energy harvesting devices
BS EN 60747-16-3:2002+A1:2009 Semiconductor devices — Part 16-3: Microwave integrated circuits — Frequency converters
BS EN 60747-16-4:2004 Discrete semiconductor devices - Microwave integrated circuits - Switches
BS EN 62047-19:2013 Semiconductor devices. Micro-electromechanical devices. Electronic compasses
BS 6493 Sec.1.4:1992 Semiconductor devices. Discrete devices. Recommendations for microwave diodes and transistors
BS IEC 62047-30:2017 Semiconductor devices. Micro-electromechanical devices - Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
23/30454374 DC BS EN IEC 62047-47. Semiconductor devices. Micro-electromechanical devices - Part 47. Silicon based MEMS fabrication technology. Measurement method of bending strength of microstructures
BS IEC 62047-42:2022 Semiconductor devices. Micro-electromechanical devices - Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
BS IEC 62047-40:2021 Semiconductor devices. Micro-electromechanical devices. Test methods of micro-electromechanical inertial shock switch threshold
BS EN IEC 62435-7:2021 Electronic components. Long-term storage of electronic semiconductor devices. Micro-electromechanical devices
BS EN 62148-5:2003 Fibre optic active components and devices - Package and interface standards - SC 1x9 fibre optic modules
BS IEC 62047-36:2019 Semiconductor devices. Micro-electromechanical devices - Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
BS EN 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Acoustic microscopy for plastic encapsulated electronic components
BS EN 62047-26:2016 Semiconductor devices. Micro-electromechanical devices. Description and measurement methods for micro trench and needle structures
18/30379483 DC BS EN 62435-7. Long-term storage of electronic components. Part 7. Micro-electromechanical devices
BS EN 60747-16-1:2002 Discrete semiconductor devices and integrated circuits - Microwave integrated circuits - Amplifiers
BS IEC 62047-29:2017 Semiconductor devices. Micro-electromechanical devices - Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
BS IEC 62047-31:2019 Semiconductor devices. Micro-electromechanical devices - Four-point bending test method for interfacial adhesion energy of layered MEMS materials
22/30437195 DC BS IEC 62047-43. Semiconductor devices. Micro-electromechanical devices - Part 43. Test method of electrical characteristics after cyclic bending deformation for flexible electro-mechanical devices
21/30436870 DC BS IEC 60747-16-9. Semiconductor devices - Part 16-9. Microwave integrated circuits. Phase shifters

PL-PKN, Microcavity device

PN T06561-1971 Microwave measuring instruments Cavity wavemeter General requirements and tests
PN-EN IEC 62435-7-2021-08 E Electronic components -- Long-term storage of electronic semiconductor devices -- Part 7: Micro-electromechanical devices (IEC 62435-7:2020)

国家药监局, Microcavity device

YY/T 1797-2021 Endoscopic surgical instruments, endoscopic cutting staplers and components

U.S. Military Regulations and Norms, Microcavity device

ARMY MIL-C-50469 NOTICE 1-1996 CHARGE, SUPPLEMENTARY FOR DEEP CAVITY LOADED PROJECTILE PARTS FOR
ARMY MIL-C-50469 (2)-1986 CHARGE, SUPPLEMENTARY FOR DEEP CAVITY LOADED PROJECTILE PARTS FOR
ARMY MIL-C-50469-1970 CHARGE, SUPPLEMENTARY FOR DEEP CAVITY LOADED PROJECTILE PARTS FOR
ARMY MIL-HDBK-175 VALID NOTICE 1-2000 MICROELECTRONIC DEVICE DATA HANDBOOK
ARMY MIL-HDBK-175-1968 MICROELECTRONIC DEVICE DATA HANDBOOK
ARMY MIL-C-50471 (5)-1990 CHARGE, SUPPLEMENTARY ASSEMBLY WITH SPACER FOR DEEP CAVITY LOADED PROJECTILE, LOADING ASSEMBLING AND PACKING
ARMY MIL-C-50471-1970 CHARGE, SUPPLEMENTARY ASSEMBLY WITH SPACER FOR DEEP CAVITY LOADED PROJECTILE, LOADING ASSEMBLING AND PACKING
ARMY MIL-C-50471 NOTICE 1-1997 CHARGE, SUPPLEMENTARY ASSEMBLY WITH SPACER FOR DEEP CAVITY LOADED PROJECTILE, LOADING ASSEMBLING AND PACKING
ARMY MIL-PRF-49040F-1999 IMAGE INTENSIFIER ASSEMBLY 25 MILLIMETER, MICROCHANNEL INVERTER MX-9644/UV
ARMY MIL-PRF-49052 G-1999 IMAGE INTENSIFIER ASSEMBLY, 18 MILLIMETER MICROCHANNEL WAFER, MX-9916/UV

SAE - SAE International, Microcavity device

SAE AS1650-1992 Coupling Assembly@ Threadless@ Flexible@ Fixed Cavity@ Self-Bonding
SAE AS1652-1992 Coupling Assembly@ Threadless - Fixed Cavity Ferrule Type@ Self Bonding
SAE AS1713B-1992 Half Coupling Subassembly@ Flexible@ Variable Cavity@ Threaded@ Ferrule Type Tube Ends
SAE AS1713C-2006 HALF COUPLING SUBASSEMBLY@ FLEXIBLE@ VARIABLE CAVITY@ THREADED FERRULE TYPE TUBE ENDS
SAE AS1650F-2018 Coupling Assembly@ Threadless@ Flexible@ Fixed Cavity@ Self-Bonding@ Procurement Specification
SAE AS1650E-2017 Coupling Assembly@ Threadless@ Flexible@ Fixed Cavity@ Self-Bonding@ Procurement Specification
SAE AS1650C-2016 Coupling Assembly@ Threadless@ Flexible@ Fixed Cavity@ Self-Bonding@ Procurement Specification
SAE AS1650D-2017 Coupling Assembly@ Threadless@ Flexible@ Fixed Cavity@ Self-Bonding@ Procurement Specification
SAE AS1738C-2009 NUT ASSEMBLY COUPLING@ RIGID@ FIXED CAVITY@ THREADED FERRULE TYPE TUBE ENDS
SAE AS1714C-1995 Nut Assembly@ Coupling@ Flexible@ Variable Cavity@ Threaded@ Ferrule Type Tube Ends
SAE AS1738B-1993 NUT ASSEMBLY COUPLING@ RIGID@ FIXED CAVITY@ THREADED FERRULE TYPE TUBE ENDS

Society of Automotive Engineers (SAE), Microcavity device

SAE AS1650-1998 COUPLING ASSEMBLY, THREADLESS, FLEXIBLE, FIXED CAVITY, SELF-BONDING
SAE AS1652A-2013 COUPLING ASSEMBLY, THREADLESS - FLEXIBLE, FIXED CAVITY, SELF-BONDING
SAE AS1712B-2004 COUPLING SUBASSEMBLY, FLEXIBLE, VARIABLE CAVITY, THREADED, FERRULE TYPE TUBE ENDS
SAE AS1712C-2013 COUPLING SUBASSEMBLY, FLEXIBLE, VARIABLE CAVITY, THREADED, FERRULE TYPE TUBE ENDS
SAE AS7515C-2023 COUPLING ASSEMBLY, THREADLESS, FLEXIBLE, FIXED CAVITY, CURRENT CARRYING, SELF BONDING
SAE AS1650A-1999 Coupling Assembly, Threadless, Flexible, Fixed Cavity, Self-Bonding, Procurement Specification
SAE AS1650A-2005 Coupling Assembly, Threadless, Flexible, Fixed Cavity, Self-Bonding, Procurement Specification
SAE AS1738A-1990 NUT ASSEMBLY COUPLING, RIGID, FIXED CAVITY, THREADED FERRULE TYPE TUBE ENDS
SAE AS1738B-2007 NUT ASSEMBLY COUPLING, RIGID, FIXED CAVITY, THREADED FERRULE TYPE TUBE ENDS
SAE AS1738C-2015 NUT ASSEMBLY COUPLING, RIGID, FIXED CAVITY, THREADED FERRULE TYPE TUBE ENDS
SAE AS1714C-2002 NUT ASSEMBLY, COUPLING, FLEXIBLE, VARIABLE CAVITY, THREADED, FERRULE TYPE TUBE ENDS
SAE AS1714-1982 NUT ASSEMBLY, COUPLING, FLEXIBLE, VARIABLE CAVITY, THREADED, FERRULE TYPE TUBE ENDS
SAE AS1714A-1984 NUT ASSEMBLY, COUPLING, FLEXIBLE, VARIABLE CAVITY, THREADED, FERRULE TYPE TUBE ENDS
SAE AS1714B-1992 NUT ASSEMBLY, COUPLING, FLEXIBLE, VARIABLE CAVITY, THREADED, FERRULE TYPE TUBE ENDS
SAE AS1714D-2013 NUT ASSEMBLY, COUPLING, FLEXIBLE, VARIABLE CAVITY, THREADED, FERRULE TYPE TUBE ENDS
SAE AS5832-2006 ASSEMBLED COUPLING COMPONENTS, THREADLESS-FLEXIBLE, FIXED CAVITY, CURRENT CARRYING, SELF BONDING FSC 4730
SAE AS1738-1984 NUT ASSEMBLY COUPLING, RIGID, FIXED CAVITY, THREADED, FERRULE TYPE TUBE ENDS, TYPE I
SAE AS1142-2002 1992 Hermeticity Testing of Microelectronic Devices

Professional Standard - Aerospace, Microcavity device

QJ 2782-1995 Terminology for Microwave Components
QJ 1886-1990 特种器件
QJ 1996-1990 Microwave device test method
QJ 1886A-1997 General Specification for Microwave Devices
QJ 2733-1995 Graphical symbols for microwave components
QJ 2492-1993 General technical conditions for microwave frequency doubler
QJ 3172-2003 Microwave components installation technical requirements
QJ 2146-1991 Classification and basic parameters of microwave devices
QJ 2300-1992 Microwave Ferrite Materials and Device Series Type Spectrum

International Electrotechnical Commission (IEC), Microcavity device

IEC 60747-4:2001 Semiconductor devices - Discrete devices - Part 4: Microwave devices
IEC 62047-33:2019 Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
IEC 62047-41:2021 Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
IEC 60127-6:1994/AMD1:1996 Amendment 1 - Miniature fuses - Part 6: Fuse-holders for miniature cartridge fuse-links
IEC 60127-3/AMD1/COR1:1994 Miniature fuses - Part 3: Sub-miniature fuse-links; Amendment 1
IEC 60127-3/AMD1/COR2:1996 Miniature fuses - Part 3: Sub-miniature fuse-links; Amendment 1
IEC 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
IEC 62047-9:2011/COR1:2012 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
IEC 60127-6:1994 Miniature fuses - Part 6: Fuse-holders for miniature cartridges fuse-links
IEC 62148-15:2014 Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages
IEC 62148-15:2009 Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages
IEC 62148-15:2021 Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages
IEC 60747-4:1991 Semiconductor devices; discrete devices; part 4: microwave diodes and transistors
IEC 60747-4:2007+AMD1:2017 CSV Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors
IEC 60747-4-2:2000 Semiconductor devices - Discrete devices - Part 4-2: Microwave diodes and transistors - Integrated-circuit microwave amplifiers - Blank detail specification
IEC 62047-34:2019 Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
IEC 60257:1968 Fuse-holders for miniature cartridge fuse-links
IEC 60747-16-3:2002/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
IEC 60747-16-1:2001/AMD2:2017 Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
IEC 60747-16-5:2013/AMD1:2020 Amendment 1 - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
IEC 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
IEC 60747-16-7:2022 Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators
IEC 60747-16-1:2001/AMD1:2007 Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
IEC 60747-16-1:2007 Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
IEC 60747-16-5:2013 Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 CSV Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
IEC 60747-16-1:2001+AMD1:2007 CSV Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
IEC 60747-16-3:2002+AMD1:2009 CSV Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
IEC 60747-16-6:2019 Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers
IEC 60747-16-5:2013+AMD1:2020 CSV Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
IEC 60747-16-8:2022 Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters
IEC 60747-16-1:2017 Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
IEC 62047-32:2019 Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators
IEC 60747-4-1:2000 Semiconductor devices - Discrete devices - Part 4-1: Microwave diodes and transistors; Microwave field effect transistors; Blank detail specification
IEC 60747-4/AMD2:1999 Semiconductor devices - Discrete devices - Part 4: Microwave devices; Amendment 2
IEC 60747-4/AMD1:1993 Semiconductor devices; discrete devices; part 4: microwave diodes and transistors; amendment 1
IEC 60747-16-3:2010 Semiconductor devices – Part 16-3: Microwave integrated circuits – Frequency converters
IEC 60148:1969 Letter symbols for semiconductor devices and integrated microcircuits
IEC 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
IEC 62047-37:2020 Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
IEC 62148-15:2021 RLV Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages
IEC 60747-16-3:2002 Semiconductor devices - Part 16-3: Microwave integrated circuits; Frequency converters
IEC 62047-15:2015 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
IEC 60747-16-4:2004/AMD1:2009 Amendment 1 - Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
IEC 60747-16-2:2001 Semiconductor devices - Part 16-2: Microwave integrated circuits; Frequency prescalers
IEC 60747-16-2:2001/AMD1:2007 Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers; Amendment 1
IEC 60747-16-2:2001+AMD1:2007 CSV Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers
IEC 60747-16-2:2008 Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers
IEC 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
IEC 62047-5:2011/COR1:2012 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches; Corrigendum 1
IEC 60747-16-4:2004/AMD2:2017 Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
IEC 60127-2/AMD2:2000 Miniature fuses - Part 2: Cartridge fuse-links; Amendment 2
IEC 60127-2:2003/AMD1:2003 Miniature fuses - Part 2: Cartridge fuse-links; Amendment 1
IEC 60747-16-4:2011 Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
IEC 60127-2/AMD1:1995 Miniature fuses - Part 2: Cartridge fuse-links; Amendment 1
IEC 60747-16-4:2004 Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 CSV Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
IEC 60747-16-4:2004+AMD1:2009 CSV Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
IEC 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
IEC 60747-16-5:2013/AMD1:2020/COR1:2020 Corrigendum 1 - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
IEC 62047-30:2017 Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
IEC 62047-40:2021 Semiconductor devices - Micro-electromechanical devices - Part 40: Test methods of micro-electromechanical inertial shock switch threshold

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Microcavity device

GB/T 20516-2006 Semiconductor devices. discrete devices. Part 4: Microwave devices
GB/T 32817-2016 Semiconductor devices.Micro-electromechanical devices.Generic specification for MEMS
GB/T 41853-2022 Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement
GB/T 42709.19-2023 Semiconductor devices microelectromechanical devices Part 19: Electronic compass
GB/T 42709.5-2023 Microelectromechanical Devices for Semiconductor Devices Part 5: RF MEMS Switches
GB/T 20870.1-2007 Semiconductor devices Part 16-1 Microwave integrated circuits Amplifiers
GB/T 20870.5-2023 Semiconductor Devices Part 16-5: Microwave Integrated Circuit Oscillators
GB/T 11281-2009 General specification for reduction gearhead of electrical micro-machine
GB/T 19404-2003 Microwave ferrite components-measuring methods for major properties
GB/T 21039.1-2007 Semiconductor devices Discrete devices Part 4-1: Microwave diodes and transistors-Microwave field effect transistors Blank detail specification
GB/T 20870.2-2023 Semiconductor Devices Part 16-2: Microwave Integrated Circuit Prescalers
GB/T 41852-2022 Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
GB/T 42709.7-2023 Semiconductor devices microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection

Association Francaise de Normalisation, Microcavity device

NF EN 62418:2011 Dispositifs à semi-conducteurs - Essai sur les cavités dues aux contraintes de la métallisation
NF EN 62047-26:2016 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 26 : description et méthodes de mesure pour structures de microtranchées et de microaiguille
NF EN 62047-12:2012 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 12 : méthode d'essai de fatigue en flexion des matériaux en couche mince utilisant les vibrations à la résonance des structures à systèmes microélectromécaniques (M...
NF EN 62149-2:2015 Composants et dispositifs actifs à fibres optiques - Norme de performance - Partie 2 : dispositifs individuels laser 850 nm à cavité verticale émettant par la surface
NF C96-050-10*NF EN 62047-10:2012 Semiconductor devices - Micro-electromechanical devices - Part 10: micro-pillar compression test for MEMS materials
NF EN 60127-6:2014 Coupe-circuit miniatures - Partie 6 : ensembles-porteurs pour cartouches de coupe-circuit miniatures
NF EN 62047-20:2014 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 20 : gyroscopes
NF EN 62047-5:2012 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 5 : commutateurs MEMS-RF
NF EN 62047-19:2014 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 19 : compas électroniques
NF C93-171:1985 Components for electronic equipment. Trimmer capacitors.
NF EN 60127-1/A1:2011 Coupe-circuit miniatures - Partie 1 : définitions pour coupe-circuit miniatures et prescriptions générales pour éléments de remplacement miniatures
NF EN 60127-1/A2:2015 Coupe-circuit miniatures - Partie 1 : définitions pour coupe-circuit miniatures et prescriptions générales pour éléments de remplacement miniatures
NF EN 60127-1:2006 Coupe-circuit miniatures - Partie 1 : définitions pour coupe-circuit miniatures et prescriptions générales pour éléments de remplacement miniatures
NF EN 62047-1:2016 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 1 : termes et définitions
NF EN 62047-4:2011 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 4 : spécification générique pour les MEMS
NF C93-884-2*NF EN 62149-2:2015 Fibre optic active components and devices - Performance standard - Part 2 : 850 nm discrete vertical cavity surface emitting laser devices
NF EN 62047-10:2012 Dispositifs à semiconducteur - Dispositifs microélectromécaniques - Partie 10 : essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS
NF C93-883-15*NF EN IEC 62148-15:2021 Fibre optic active components and devices - Package and interface standards - Part 15 : discrete vertical cavity surface emitting laser packages
NF C93-883-15*NF EN 62148-15:2015 Fibre optic active components and devices - Package and interface standards - Part 15 : discrete vertical cavity surface emitting laser packages
NF EN 60127-7:2016 Coupe-circuit miniatures Partie 7 : éléments de remplacement miniatures pour applications spéciales
NF EN 60127-5:2017 Coupe-circuit miniatures - Partie 5 : lignes directrices pour l'évaluation de la qualité des éléments de remplacement miniatures
NF EN IEC 62435-7:2021 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 7 : dispositifs microélectromécaniques
NF C96-435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7 : micro-electromechanical devices
NF EN 62047-11:2014 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 11 : méthode d'essai pour les coefficients de dilatation thermique linéaire des matériaux autonomes pour systèmes microélectromécaniques
NF C96-050-7*NF EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7 : MEMS BAW filter and duplexer for radio frequency control and selection
NF EN 62047-2:2006 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 2 : méthodes d'essais de traction des matériaux en couche mince
NF EN 62047-18:2014 Dispositifs à semiconducteurs - Dispositif microélectromécaniques - Partie 18 : méthodes d'essai de flexion des matériaux en couche mince
NF C96-016-5*NF EN 60747-16-5:2014 Semiconductor devices - Part 16-5 : microwave integrated circuits - Oscillators
NF C96-016-1/A1*NF EN 60747-16-1/A1:2013 Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers
NF C96-016-1/A2*NF EN 60747-16-1/A2:2017 Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers
NF EN IEC 60747-16-8:2023 Dispositifs à semiconducteurs - Partie 16-8 : circuits intégrés hyperfréquences - Limiteurs
NF EN 60747-16-1/A1:2013 Dispositifs à semiconducteurs - Partie 16-1 : circuits intégrés hyperfréquences - Amplificateurs
NF EN 60747-16-1:2003 Dispositifs à semiconducteurs - Partie 16-1 : circuits intégrés hyperfréquences - Amplificateurs
NF EN IEC 60747-16-6:2019 Dispositifs à semiconducteurs - Partie 16-6 : circuits intégrés hyperfréquences - Multiplicateurs de fréquence
NF EN 60747-16-5/A1:2020 Dispositifs à semiconducteurs - Partie 16-5 : circuits intégrés hyperfréquences - Oscillateurs
NF EN 60747-16-1/A2:2017 Dispositifs à semiconducteurs - Partie 16-1 : circuits intégrés hyperfréquences - Amplificateurs
NF EN IEC 60747-16-7:2023 Dispositifs à semiconducteurs - Partie 16-7 : circuits intégrés hyperfréquences - Atténuateurs
NF EN 60747-16-5:2014 Dispositifs à semiconducteurs - Partie 16-5 : Circuits intégrés hyperfréquences - oscillateurs
NF C96-050-25*NF EN 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
NF EN 62047-3:2006 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 3 : éprouvettes d'essai normalisée en couche mince pour l'essai de traction
NF EN 60127-3:2015 Coupe-circuit miniatures - Partie 3 : éléments de remplacement subminiatures
NF EN 60127-3/A1:2020 Coupe-circuit miniatures - Partie 3 : éléments de remplacement subminiatures
NF EN 62047-6:2010 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 6 : méthodes d'essais de fatigue axiale des matériaux en couche mince
NF EN 62047-9:2012 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 9 : mesure de la résistance de collage de deux plaquettes pour les MEMS
NF EN 60747-16-3/A2:2017 Dispositifs à semiconducteurs - Partie 16-3 : circuits intégrés hyperfréquences - Convertisseurs de fréquence
NF EN 60747-16-3/A1:2013 Dispositifs à semiconducteurs - Partie 16-3 : circuits intégrés hyperfréquences - Convertisseurs de fréquence
NF EN 60747-16-3:2003 Dispositifs à semiconducteurs - Partie 16-3 : circuits intégrés hyperfréquences - Convertisseurs de fréquence
NF EN 62047-7:2011 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 7 : filtre et duplexeur BAW MEMS pour la commande et le choix des fréquences radioélectriques
NF EN 62047-21:2014 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 21 : méthode d'essai relative au coefficient de Poisson des matériaux MEMS en couche mince
NF EN 62047-25:2016 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 25 : technologie de fabrication de MEMS à base de silicium - Méthode de mesure de la résistance à la traction-compression et au cisaillement d'une micro zone de brasure
NF Z43-010:1984 Micrographics. Legibility test for microform readers. Description and use of iso micromire iso no 1.
UTE C93-720U*UTE C93-720:1995 Electronic components. Inspection of printed boards for microwave applications.
NF EN 62047-14:2012 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 14 : méthode de mesure des limites de formage des matériaux à couche métallique
NF C96-050-5*NF EN 62047-5:2012 Semiconductor devices - Micro-electromechanical devices - Part 5 : RF MEMS switches.
NF C96-050-20*NF EN 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20 : gyroscopes
NF C96-016-4*NF EN 60747-16-4:2004 Semiconductor devices - Part 16-4 : microwave integrated circuits - Switches
NF C96-016-4/A2*NF EN 60747-16-4/A2:2017 Semiconductor devices - Part 16-4 : microwave integrated circuits - Switches
NF EN 60747-16-4/A1:2012 Dispositifs à semiconducteurs - Partie 16-4 : circuits intégrés hyperfréquences - Commutateurs
NF EN 60747-16-4:2004 Dispositifs à semiconducteurs - Partie 16-4 : circuits intégrés hyperfréquences - Commutateurs
NF EN 60747-16-4/A2:2017 Dispositifs à semiconducteurs - Partie 16-4 : circuits intégrés hyperfréquences - Commutateurs
NF C96-050-17*NF EN 62047-17:2015 Semiconductor devices - Micro-electromechanical devices - Part 17 : bulge test method for measuring mechanical properties of thin films
NF EN 62047-17:2015 Dispositifs à semiconducteurs - Dispositifs-microélectromécaniques - Partie 17 : méthode d'essai de renflement pour la mesure des propriétés mécaniques des couches minces

Professional Standard - Medicine, Microcavity device

YY/T 0127.12-2008 Dentistry.Biological evaluation of medical devices used in dentistry Part 2:Test method.Micronucleus test

Danish Standards Foundation, Microcavity device

DS/EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
DS/EN 62149-2:2009 Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices
DS/EN 62149-7:2012 Fibre optic active components and devices - Performance standards - Part 7: 1 310 nm discrete vertical cavity surface emitting laser devices
DS/EN 62047-1:2006 Semiconductor devices – Micro-electromechanical devices – Part 1: Terms and definitions
DS/EN IEC 62435-7:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 7: Micro-electromechanical devices
DS/EN 62148-15:2010 Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages
DS/EN IEC 62148-15:2021 Fibre optic active components and devices – Package and interface standards – Part 15: Discrete vertical cavity surface emitting laser packages
DS/EN 62047-3:2007 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
DS/EN 60747-16-1/A1:2007 Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
DS/EN 60747-16-1:2002 Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
DS/EN 60747-16-5:2013 Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
DS/EN 62047-2:2007 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
DS/EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
DS/EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
DS/EN 60747-16-3/A1:2009 Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
DS/EN 60747-16-3:2002 Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
DS/EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
DS/EN 60747-16-4/A1:2011 Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
DS/EN 60747-16-4:2004 Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

ES-UNE, Microcavity device

UNE-EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (Endorsed by AENOR in December of 2011.)
UNE-EN 62149-2:2014 Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices (Endorsed by AENOR in October of 2014.)
UNE-EN 62149-7:2012 Fibre optic active components and devices - Performance standards - Part 7: 1 310 nm discrete vertical cavity surface emitting laser devices (Endorsed by AENOR in July of 2012.)
UNE-EN 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (Endorsed by AENOR in November of 2014.)
UNE-EN 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (Endorsed by AENOR in November of 2011.)
UNE-EN 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (Endorsed by AENOR in November of 2013.)
UNE-EN 62047-26:2016 Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (Endorsed by AENOR in June of 2016.)
UNE-EN 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (Endorsed by AENOR in May of 2016.)
UNE-EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices -- Part 4: Generic specification for MEMS (Endorsed by AENOR in February of 2011.)
UNE-EN 62148-15:2014 Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages (Endorsed by AENOR in October of 2014.)
UNE-EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices (Endorsed by Asociación Española de Normalización in April of 2021.)
UNE-EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices -- Part 3: Thin film standard test piece for tensile testing (IEC 62047-3:2006) (Endorsed by AENOR in January of 2007.)
UNE-EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)
UNE-EN 62047-11:2013 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (Endorsed by AENOR in November of 2013.)
UNE-EN IEC 60747-16-6:2019 Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (Endorsed by Asociación Española de Normalización in October of 2019.)
UNE-EN 60747-16-5:2013/A1:2020 Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (Endorsed by Asociación Española de Normalización in October of 2020.)
UNE-EN 60747-16-1:2002 Semiconductor devices -- Part 16-1: Microwave integrated circuits - Amplifiers (Endorsed by AENOR in July of 2002.)
UNE-EN IEC 60747-16-7:2023 Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (Endorsed by Asociación Española de Normalización in February of 2023.)
UNE-EN IEC 60747-16-8:2023 Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters (Endorsed by Asociación Española de Normalización in February of 2023.)
UNE-EN 60747-16-5:2013 Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (Endorsed by AENOR in October of 2013.)
UNE-EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)
UNE-EN 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (Endorsed by Asociación Española de Normalización in January ...
UNE-EN 60747-16-3:2002/A2:2017 Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (Endorsed by Asociación Española de Normalización in January of 2018.)
UNE-EN 60747-16-3:2002/A1:2009 Semiconductor devices -- Part 16-3: Microwave integrated circuits - Frequency converters (Endorsed by AENOR in July of 2009.)
UNE-EN 60747-16-3:2002 Semiconductor devices -- Part 16-3: Microwave integrated circuits - Frequency converters. (Endorsed by AENOR in December of 2002.)
UNE-EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (Endorsed by AENOR in November of 2011.)
UNE-EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices -- Part 6: Axial fatigue testing methods of thin film materials (Endorsed by AENOR in June of 2010.)
UNE-EN 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (Endorsed by AENOR in November of 2014.)
UNE-EN 60747-16-4:2004/A1:2011 Semiconductor devices -- Part 16-4: Microwave integrated circuits - Switches (Endorsed by AENOR in April of 2011.)
UNE-EN 60747-16-4:2004/A2:2017 Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (Endorsed by Asociación Española de Normalización in December of 2017.)
UNE-EN 60747-16-4:2004 Semiconductor devices -- Part 16-4: Microwave integrated circuits - Switches (Endorsed by AENOR in November of 2004.)
UNE-EN 301908-11 V3.2.1:2006 Semiconductor devices - Micro-electromechanical devices -- Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006). (Endorsed by AENOR in January of 2007.)
UNE-EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices -- Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006). (Endorsed by AENOR in January of 2007.)
UNE-EN 300417-5-1 V1.1.3:2006 Semiconductor devices - Micro-electromechanical devices -- Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006). (Endorsed by AENOR in January of 2007.)
UNE-EN 62047-17:2015 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (Endorsed by AENOR in August of 2015.)
UNE-EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (Endorsed by AENOR in June of 2012.)

German Institute for Standardization, Microcavity device

DIN EN 62047-10:2012-03 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
DIN EN 62047-19:2014-04 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 62047-19:2013); German version EN 62047-19:2013
DIN EN 62047-5:2012-03 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (IEC 62047-5:2011); German version EN 62047-5:2011
DIN EN 62047-26:2016-12 Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016); German version EN 62047-26:2016
DIN EN 62047-4:2011-03 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010
DIN EN 62047-1:2016-12 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2016); German version EN 62047-1:2016 / Note: DIN EN 62047-1 (2006-10) remains valid alongside this standard until 2019-02-10.
DIN EN 62149-2:2015 Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices (IEC 62149-2:2014); German version EN 62149-2:2014
DIN EN 62149-2:2010 Fibre optic active components and devices - Performance standards - Part 2:850 nm discrete vertical cavity surface emitting laser devices (IEC 62149-2:2009); German version EN 62149-2:2009
DIN 32563:2002 Production equipment for microsystems - System for classification of components for microsystems
DIN EN IEC 62148-15:2022-10 Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages (IEC 62148-15:2021); German version EN IEC 62148-15:2021 / Note: DIN EN 62148-15 (2015-03) remains valid alo...
DIN 13902-2:2005 Dentistry - Terminology of oral implantology - Part 2: Instruments and dental laboratory parts
DIN EN 62047-20:2015-04 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 62047-20:2014); German version EN 62047-20:2014
DIN EN 62047-3:2007-02 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006); German version EN 62047-3:2006
DIN EN IEC 62148-15:2020 Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages (IEC 86C/1647/CDV:2020); German and English version prEN IEC 62148-15:2020
DIN EN 62047-9:2012-03 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
DIN EN 62047-2:2007-02 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
DIN EN 62047-11:2014-04 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013
DIN EN 60747-16-1:2007 Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (IEC 60747-16-1:2001 + A1:2007); German version EN 60747-16-1:2002 + A1:2007
DIN EN 60747-16-5:2021-08 Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013 + A1:2020 + COR1:2020); German version EN 60747-16-5:2013 + A1:2020 / Note: DIN EN 60747-16-5 (2014-04) remains valid alongside this standard until 2023...
DIN EN IEC 60747-16-6:2021-08 Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 60747-16-6:2019); German version EN IEC 60747-16-6:2019
DIN EN 60747-16-1:2017-10 Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (IEC 60747-16-1:2001 - A1:2007 - A2:2017); German version EN 60747-16-1:2002 + A1:2007 + A2:2017 / Note: DIN EN 60747-16-1 (2007-10) remains valid alongside this standard unt...
DIN EN 62047-10:2012 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
DIN EN 62047-18:2014-04 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
DIN EN 62047-25:2017-04 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
DIN EN 62047-6:2010-07 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010
DIN EN 60747-16-3:2018-04 Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002 + A1:2009 + A2:2017); German version EN 60747-16-3:2002 + A1:2009 + A2:2017 / Note: DIN EN 60747-16-3 (2009-11) remains valid alongside this st...
DIN EN 62047-7:2012-02 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011); German version EN 62047-7:2011
DIN EN 62047-9:2012 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
DIN EN 60747-16-4:2018-04 Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009 + A2:2017); German version EN 60747-16-4:2004 + A1:2011 + A2:2017 / Note: DIN EN 60747-16-4 (2011-08) remains valid alongside this standard until...
DIN EN 62047-17:2015-12 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015); German version EN 62047-17:2015
DIN EN 62047-14:2012-10 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012
DIN EN IEC 60747-16-9:2022 Semiconductor devices - Part 16-9: Microwave integrated circuits - Phase shifters (IEC 47E/768/CD:2021); Text in German and English
DIN EN 60747-16-5/A1:2019 Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 47E/649/CD:2019); Text in German and English

CENELEC - European Committee for Electrotechnical Standardization, Microcavity device

EN 62149-7:2012 Fibre optic active components and devices - Performance standards - Part 7: 1 310 nm discrete vertical cavity surface emitting laser devices

TH-TISI, Microcavity device

TIS 527-1984 Standard for miniature fuse: fuse-holders
TIS 526.6-2012 Miniature fuses.part 6: fuse.holders for miniature cartridge fuse.links

Military Standard of the People's Republic of China-General Armament Department, Microcavity device

GJB/Z 83-1996 Selection Guide for Aerospace Electronic Components Microwave Components
GJB 10191-2021 General specifications for microwave device enclosures
GJB 2650-1996 Microwave component performance testing methods
GJB 548B-2005 Test methods and procedures for microelectronic device
GJB 548A-1996 Microelectronic device test methods and procedures
GJB 548C-2021 Microelectronic device test methods and procedures
GJB 548-1988 Microelectronic device test methods and procedures
GJB 757-1989 Synthetic mica large single chip for radar microwave devices
GJB 8481/3-2021 Detailed specification for microwave component WBB0008 quintuple frequency multiplier
GJB 8481/2-2021 Detailed specification for microwave component WBB0006 eight-order frequency multiplier
GJB 8481/1-2021 Detailed specification for microwave component WBB0002 eight-order frequency multiplier
GJB 1557A-2021 Semiconductor discrete device microwave diode dimensions
GJB 1557-1992 Semiconductor discrete device microwave diode dimensions
GJB 8481/4-2021 Detailed specifications for microwave component WBB0009 type 18-order frequency multiplier
GJB 10196-2021 Accelerated life test method for solid-state microwave power devices
GJB/Z 40.3-1993 Military vacuum electronic device series spectrum microwave tubes
GJB/Z 41.1-1993 Military semiconductor discrete device series spectrum microwave diodes

ECIA - Electronic Components Industry Association, Microcavity device

396-1971 Resistors@ Fixed Film Microelement

European Committee for Electrotechnical Standardization（CENELEC）, Microcavity device

EN 62149-2:2009 Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices
EN 62149-2:2014 Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices
EN 62047-26:2016 Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
EN IEC 62148-15:2021 Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages
EN 62148-15:2010 Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages
EN 62148-15:2014 Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages
EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
EN 60747-16-5:2013 Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
EN 60747-16-5:2013/A1:2020 Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
EN IEC 60747-16-6:2019 Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers
EN 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
EN 60747-16-3:2002 Semiconductor devices Part 16-3: Microwave integrated circuits - Frequency converters (Incorporates Amendment A1: 2009)
EN 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
EN 62047-15:2015 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
EN 60335-2-52:2003 Household and similar electrical appliances - Safety Part 2-52: Particular requirements for oral hygiene appliances (Incorporates Amendment A11: 2010; Incorporating corrigendum June 2012)
EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
EN 62047-2:2006 Semiconductor devices Micro-electromechanical devices Part 2: Tensile testing method of thin film materials
EN 60747-16-1:2002 Semiconductor devices Part 16-1: Microwave integrated circuits - Amplifiers (Incorporates Amendment A1: 2007)
EN 62047-17:2015 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

Professional Standard - Machinery, Microcavity device

JB/T 6849-1993 Microphotography Technology Specifications for Microform Reader Screens
JB/T 5538-1991 General technical conditions for micro-control regulators

未注明发布机构, Microcavity device

BS EN 62047-5:2011(2012) Semiconductor devices — Micro - electromechanical devices Part 5 : RF MEMS switches
BS IEC 60747-4:2007+A1:2017(2020) Semiconductor devices — Discrete devices Part 4 : Microwave diodes and transistors
BS EN 62047-9:2011(2012) Semiconductor devices — Micro - electromechanical devices Part 9 : Wafer to wafer bonding strength measurement for MEMS

BELST, Microcavity device

STB 967-94 Micro-assemblies and acoustic wave devices. Classification and symbol

United States Navy, Microcavity device

NAVY QPL-5504-35 NOTICE 1-2007 FILTERS AND FILTER ELEMENTS, FLUID PRESSURE, HYDRAULIC MICRONIC TYPE
NAVY QPL-5504-35-2002 FILTERS AND FILTER ELEMENTS, FLUID PRESSURE, HYDRAULIC MICRONIC TYPE
NAVY QPL-5504-2012 FILTERS AND FILTER ELEMENTS, FLUID PRESSURE, HYDRAULIC MICRONIC TYPE
NAVY QPL-5504-2011 FILTERS AND FILTER ELEMENTS, FLUID PRESSURE, HYDRAULIC MICRONIC TYPE
NAVY MIL-F-5504 B NOTICE 1-1996 FILTERS AND FILTER ELEMENTS, FLUID PRESSURE, HYDRAULIC MICRONIC TYPE
NAVY MIL-F-5504 B (3)-1982 FILTERS AND FILTER ELEMENTS, FLUID PRESSURE, HYDRAULIC MICRONIC TYPE
NAVY MIL-F-5504 B-1958 FILTERS AND FILTER ELEMENTS, FLUID PRESSURE, HYDRAULIC MICRONIC TYPE
NAVY QPL-8815-36-2002 FILTER AND FILTER ELEMENTS, FLUID PRESSURE, HYDRAULIC LINE, 15 MICRON ABSOLUTE AND 5 MICRON ABSOLUTE, TYPE II SYSTEMS, GENERAL SPECIFICATION FOR
NAVY QPL-8815-2013 Filter and Filter Elements, Fluid Pressure, Hydraulic Line, 15 Micron Absolute and 5 Micron Absolute, Type II Systems; General Specification for

Lithuanian Standards Office , Microcavity device

LST EN 62047-10-2011 Semiconductor devices - Micro-electromechanical devices -- Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011)
LST EN 62149-7-2012 Fibre optic active components and devices - Performance standards -- Part 7: 1 310 nm discrete vertical cavity surface emitting laser devices (IEC 62149-7:2012)
LST EN IEC 62148-15:2021 Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages (IEC 62148-15:2021)
LST EN 62047-4-2011 Semiconductor devices - Micro-electromechanical devices -- Part 4: Generic specification for MEMS (IEC 62047-4:2008)
LST EN 62148-15-2010 Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages (IEC 62148-15:2009)
LST EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices (IEC 62435-7:2020)
LST EN 62148-15-2014 Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages (IEC 62148-15:2014)
LST EN 62047-3-2007 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing (IEC 62047-3:2006)
LST EN 62047-9-2011 Semiconductor devices - Micro-electromechanical devices -- Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011)
LST EN 62047-2-2007 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006)
LST EN 62047-7-2011 Semiconductor devices - Micro-electromechanical devices -- Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011)
LST EN 62047-6-2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009)
LST EN 60747-16-3-2003 Semiconductor devices. Part 16-3: Microwave integrated circuits. Frequency converters (IEC 60747-16-3:2002)
LST EN 60747-16-1-2003 Semiconductor devices. Part 16-1: Microwave integrated circuits. Amplifiers (IEC 60747-16-1:2001)

Professional Standard - Electron, Microcavity device

SJ 2524-1984 Specification for microwave reference signal generators
SJ/T 10747-1996 color codes for lead wires of microwave devices
SJ 2241-1982 Generic specification for variable concentric trimmer capacitors
SJ 1583-1980 General specification for glass dielectric trimmer capacitors
SJ 1624-1980 Generic specification for ferrite isolators and circulators intended for applications at microwave frequency
SJ 20527.2-1995 Microwave assembly.detail specification for model WFZ817 voltage controlled oscillator
SJ 20527.3-2001 Microwave assembly detail specification for model WFZ816A voltage controlled oscillator
SJ 2915-1988 Terms and definitions for single crystal microwave ferrite devices
SJ 20527.6-2003 Microwave assembly Detail specification for model WFB2002 low noise amplifier
SJ 20527.1-1995 Microwave assembly.Detail specification for model WFH362 double balanced mixer
SJ 2240-1982 Generic specification for variable air dielectric vane trimmer capacitors
SJ 20527.7-2003 Microwave assembly Detail specification for model WFZ1006 phased locked dielectric resonator oscillator
SJ/T 10931-1996 Detailed specifications for electronic components - Semiconductor microcomputer integrated circuits - Cμ6800 8-bit microprocessors (Applicable for certification)
SJ 2739-1986 Performance requirements for gear speed reduction unit of electrical micro-machines for automatic control systems
SJ/T 10037-1991 Detail specification for electronic components semiconductor integrated circuit Cμ402 4-bit microprocesor

RU-GOST R, Microcavity device

GOST 23468-1985 Microcalculators. General specifications
GOST 24459-1980 Intergated microcircuits for storages and its elements. Basic parameters
GOST 28623-1990 Semiconductor devices. Part 10. General specification for discrete devices and integrated circuits
GOST R 54843-2011 Microsystem technology products. Sensitive elements of microelectromechanical transducers of physical quantities. Generic specifications
GOST R 50730.2-1995 Microwave ferrite devices. Methods of measurement of losses at high power level

Professional Standard - Aviation, Microcavity device

HBm 65.4-1987 Specifications for Minivan Clutch
HBm 65.14-1988 Specifications for final drive and differential of miniature trucks
HBm 66.14-1988 Specifications for final drive and differential of miniature trucks
HBm 66.54-1990 Specifications for electric water enclosures for minivans
HBm 65.5-1987 Assembly technical conditions for clutches of miniature trucks
HBm 66.38-1990 Specifications for Planetary and Side Shaft Gears of Miniature Truck Differentials

Japanese Industrial Standards Committee (JISC), Microcavity device

JIS C 5630-26:2017 Semiconductor devices -- Micro-electromechanical devices -- Part 26: Description and measurement methods for micro trench and needle structures
JIS C 2565:1992 Measuring methods for ferrite cores for microwave device
JIS C 5630-3:2009 Semiconductor devices -- Micro-electromechanical devices-- Part 3: Thin film standard test piece for tensile testing
JIS C 5630-2:2009 Semiconductor devices -- Micro-electromechanical devices-- Part 2: Tensile testing method of thin film materials
JIS C 5630-20:2015 Semiconductor devices -- Micro-electromechanical devices -- Part 20: Gyroscopes
JIS K 3602 AMD 1:2006 Apparatus for the estimation of biochemical oxygen demand (BODs) with microbial sensor (Amendment 1)

Underwriters Laboratories (UL), Microcavity device

UL 586-1990 High-efficiency, particulate, air filter units
UL 586-1996 High-efficiency, particulate, air filter units

Professional Standard - Chemical Industry, Microcavity device

HG/T 4380-2012 Specification for solid-liquid mini-hydrocyclone
HG/T 5106-2016 Standard specifications of gas-liquid mini-cyclone for chemical process
HG/T 3916-2006 Water system specification for micro-computer sterilizer with frequency spectrum

Group Standards of the People's Republic of China, Microcavity device

T/CEEIA 397-2019 Technical conditions for the central control device of micro-grid
T/CITSA 13-2021 Traffic incident detection-technical specification for microwave traffic incident detector
T/CASAS 029-2023 Test method for microwave characteristics of Sub-6GHz GaN radio-frequency devices
T/CIE 146-2022

American National Standards Institute （ANSI), Microcavity device

BS EN IEC 60747-16-7:2022 Semiconductor devices Microwave integrated circuits. Attenuators (British Standard)
BS EN IEC 60747-16-8:2022 Semiconductor devices Microwave integrated circuits. Limiters (British Standard)
ANSI/EIA 967:2012 Specification for Micro Serial Attachment 3 GBs 4X Unshielded Connector

PH-BPS, Microcavity device

PNS IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices

Korean Agency for Technology and Standards (KATS), Microcavity device

KS C IEC 60747-4:2006 Semiconductor devices－Discrete devices－Part 4：Microwave diodes and transistors
KS C IEC 60747-4:2017 Semiconductor devices－Discrete devices－Part 4：Microwave diodes and transistors
KS C IEC 60747-4:2022 Semiconductor devices — Discrete devices — Part 4: Microwave diodes and transistors
KS C IEC 60747-4-2-2002(2022) Semiconductor devices－Discrete devices－Part 4－2：Microwave diodes and transistors－Integrated-circuit microwave amplifiers－Blank detail specification
KS C IEC 60747-4-2-2002(2017) Semiconductor devices－Discrete devices－Part 4－2：Microwave diodes and transistors－Integrated-circuit microwave amplifiers－Blank detail specification
KS C 2123-1997(2002) MEASURING METHODS FOR FERRITE CORES FOR MICROWAVE DEVICES
KS C 2123-1982 MEASURING METHODS FOR FERRITE CORES FOR MICROWAVE DEVICES
KS C IEC 62047-18:2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-22:2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-18-2016(2021) Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-22-2016(2021) Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 60747-4-1-2002(2017) Semiconductor devices－Discrete devices－Part 4－1：Microwave diodes and transistors－Microwave field effect transistors－Blank detail specification
KS C IEC 60747-4-2:2002 Semiconductor devices－Discrete devices－Part 4－2：Microwave diodes and transistors－Integrated-circuit microwave amplifiers－Blank detail specification
KS C IEC 62047-7-2015(2020) SEMICONDUCTOR DEVICES ― MICRO-ELECTROMECHANICAL DEVICES ― Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
KS C IEC 60747-4-1:2002 Semiconductor devices－Discrete devices－Part 4－1：Microwave diodes and transistors－Microwave field effect transistors－Blank detail specification
KS C IEC 62047-7:2015 SEMICONDUCTOR DEVICES ― MICRO-ELECTROMECHANICAL DEVICES ― Part 7: MEMS BAW filter and duplexer for radio frequency control and selection

KR-KS, Microcavity device

KS C IEC 60747-4-2017 Semiconductor devices－Discrete devices－Part 4：Microwave diodes and transistors
KS C IEC 60747-4-2022 Semiconductor devices — Discrete devices — Part 4: Microwave diodes and transistors

Defense Logistics Agency, Microcavity device

DLA SMD-5962-10220-2013 MICROCIRCUIT, HYBRID, NUCLEAR EVENT DETECTOR, LOW POWER
DLA MIL-M-38510/18 B VALID NOTICE 1-2010 Microcircuits, Digital, TTL, Register File, Monolithic Silicon
DLA MS24287 REV D VALID NOTICE 2-2013 Mated Assembly, Connector, Rack and Panel, Miniature
DLA MS24287 REV D VALID NOTICE 1-2013 Mated Assembly, Connector, Rack and Panel, Miniature
DLA SMD-5962-88586 REV D-2004 MICROCIRCUIT, HYBRID, LINEAR, MIL-STD-1553, BUS TO MICROPROCESSOR INTERFACE UNIT
DLA MIL-DTL-83513/5 H (2)-2010 CONNECTORS, ELECTRICAL, RECTANGULAR, MICROMINIATURE, MOUNTING HARDWARE
DLA SMD-5962-90573 REV A-2012 MICROCIRCUIT, MEMORY, DIGITAL, BIPOLAR, ECL, PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
DLA MS24695 REV A VALID NOTICE 1-2013 Spring Loaded Mounting Assembly, Connector, Rack and Panel, Miniature
DLA SMD-5962-92121 REV A-2012 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ELECTRICALLY ERASABLE PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
DLA SMD-5962-93085 REV B-2008 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ELECTRICALLY ERASABLE PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
DLA SMD-5962-94668 REV B-2008 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ELECTRICALLY ERASABLE PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
DLA A-A-55151 A-2012 CONNECTORS, ELECTRICAL, RECTANGULAR, MINIATURE, POLARIZED SHELL, PLUG AND RECEPTACLE, BAIL LOCKING HARDWARE KIT
DLA SMD-5962-77042 REV J-2005 MICROCIRCUITS, DIGITAL, LOW POWER SCHOTTKY TTL, REGISTER FILE, MONOLITHIC SILICON
DLA SMD-5962-95557 REV B-2010 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ELECTRICALLY ALTERABLE FLASH PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
DLA SMD-5962-89476 REV A-2011 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, UV ERASABALE PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
DLA SMD-5962-92338 REV A-2012 MICROCIRCUIT, MEMORY, DIGITAL, BICMOS, ONE TIME PROGRAMMABLE, PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
DLA SMD-5962-94684 REV A-2013 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ELECTRICALLY ALTERABLE FLASH PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
DLA SMD-5962-94713 REV A-2013 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ELECTRICALLY ALTERABLE FLASH PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
DLA SMD-5962-92158 REV C-2008 MICROCIRCUIT, MEMORY, DIGITAL, CMOS 64 - MACROCELL ELECTRICALLY PROGRAMMABLE LOGIC DEVICE MONOLITHIC SILICON
DLA SMD-5962-97597 REV B-2008 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ELECTRICALLY ALTERABLE FLASH PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
DLA SMD-5962-97599 REV B-2008 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ELECTRICALLY ALTERABLE FLASH PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON

Institute of Interconnecting and Packaging Electronic Circuits (IPC), Microcavity device

IPC TM-650 2.6.22-1995 Acoustic Microscopy for Plastic Encapsulated Electronic Components

US-Unspecified Preparing Activity, Microcavity device

DI-MGMT-81763 A-2009 Customized Microelectronics Devices Source Protection Plan

国家机械工业局, Microcavity device

JB/T 8256.1-1999 Transparent Microform Reader Lens Technical Conditions
JB/T 8256.2-1999 Transparent microform reader inspection film technical conditions

机械电子工业部, Microcavity device

JB/T 5373.3-1991 8mm groove system combination fixture fine adjustment positioner

European Committee for Standardization (CEN), Microcavity device

EN ISO 22916:2022 Microfluidic devices - Interoperability requirements for dimensions, connections and initial device classification (ISO 22916:2022)

International Organization for Standardization (ISO), Microcavity device

ISO 22916:2022 Microfluidic devices — Interoperability requirements for dimensions, connections and initial device classification

CN-QIYE, Microcavity device

Q/GDW 11179.13-2015 Technical Specifications for Components for Energy Meters Part 13: Microcontrollers

Professional Standard - Electricity, Microcavity device

DL/T 770-2001 General specifications for microprocessor-based transformer protection equipment

IEEE - The Institute of Electrical and Electronics Engineers@ Inc., Microcavity device

IEEE C37.231-2006 Microprocessor-Based Protection Equipment Firmware Control
IEEE 694-1985 Standard for Microprocessor Assembly Language (IEEE Computer Society Document)
IEEE 1754-1994 Standard for a 32-Bit Microprocessor Architecture (IEEE Computer Society Document)

TR-TSE, Microcavity device

TS 664 LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES ND INTEGRATED MICROCIRCUITS

AENOR, Microcavity device

UNE 21321:1978 LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES AND INTEGRATED MICROCIRCUITS.

工业和信息化部, Microcavity device

YD/T 2827.5-2015 Measurement methods for passive intermodulation levels of wireless communication RF and microwave devices Part 5: Filter devices
SJ/T 11703-2018 Test method for crosstalk characteristics of digital microelectronic device packaging
SJ/T 11705-2018 Ground and power supply impedance test methods for microelectronic device packages

BE-NBN, Microcavity device

NBN I-901-1968

Electronic Components, Assemblies and Materials Association, Microcavity device

ECA EIA-967-2012 Specification for Micro Serial Attachment 3 Gbs 4X Unshielded Connector

Professional Standard - Non-ferrous Metal, Microcavity device

YS/T 942-2013 Specification of precious metals and their alloy brazing filler materials for microwave magnetrons devices

AT-OVE/ON, Microcavity device

OVE EN 60747-16-5-2021 Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (german version)

IECQ - IEC: Quality Assessment System for Electronic Components, Microcavity device

QC 750115-2000 Semiconductor Devices - Discrete Devices - Part 4-1: Microwave Diodes and Transistors - Microwave Field Effect Transistors - Blank Detail Specification (IEC 60747-4-1:2000)

Professional Standard - Agriculture, Microcavity device

NY 664-2003 Specifications for electronic auto-balance for micro hydraulic generator equipment