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Substrate flip chip and other micro-packaging options and applications

Substrate flip chip and other micro-packaging options and applications, Total:1 items.

In the international standard classification, Substrate flip chip and other micro-packaging options and applications involves: Pipeline components and pipelines.

Institute of Interconnecting and Packaging Electronic Circuits (IPC), Substrate flip chip and other micro-packaging options and applications

• IPC J-STD-030-2005 JOINT INDUSTRY STANDARD Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages

Others:   Substrate flip chip and other micro-packaging options and applications, Joint Industry Standard Guidelines for Substrate Flip Chip and Other Micropackage Selection and Application.