Institute of Interconnecting and Packaging Electronic Circuits (IPC), ipc j-std-003
IPC J-STD-026-1999 Semiconductor Design Standard for Flip Chip Applications IPC/EIA J-STD-026
IPC J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC/EIA J-STD-028
IPC - Association Connecting Electronics Industries, ipc j-std-003
IPC J-STD-001FS SPANISH-2014 Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
IPC J-STD-001ES-2010 Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic Assemblies
IPC J-STD-001FS-2015 Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
IPC J-STD-001FS CHINESE-2015 Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
IPC J-STD-001FS-2017 Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies (Incorporates Amendment 1: February 2016)
IPC J-STD-001GS CHINESE-2018 Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies
US-ACEI, ipc j-std-003
IPC IPC/JEDEC J-STD-020B-2002 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Supersedes IPC/JEDEC J-STD-020A
IPC IPC/JEDEC J-STD-033A-2002 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices Supersedes IPC/JEDEC J-STD-033