L56 半导体集成电路 标准查询与下载

DIN EN 60747-16-4:2018 半导体器件.第16-4部分:微波集成电路.开关(IEC 60747-16-4-2004+A1-2009+A2-2017);德文版本EN 60747-16-4-2004+A1-2011+A2-2017

This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave switches.

Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009 + A2:2017); German version EN 60747-16-4:2004 + A1:2011 + A2:2017

SJ/T 11702-2018 半导体集成电路 串行外设接口测试方法

Semiconductor integrated circuit serial peripheral interface test method

SJ/T 11701-2018 通用NAND型快闪存储器接口

Universal NAND flash memory interface

DIN EN 62228-2:2017 集成电路.收发器EMC评估.第2部分:LIN收发器(IEC 62228-2-2016);德文版本EN 62228-2-2017

This document specifies test and measurement methods, test conditions, test setups, test procedures, failure criteria and test signals for the EMC evaluation of ICs with integrated LIN transceivers concerning disturbances on signal and voltage supply lines.

Integrated circuits - EMC evaluation of transceivers - Part 2: LIN transceivers (IEC 62228-2:2016); German version EN 62228-2:2017

DIN EN 62433-4:2017 EMC IC建模.第4部分:用于RF抗干扰能力的行为模拟集成电路模型.传导抗扰度建模(ICIM-CI)(IEC 62433-4-2016);德文版本EN 62433-4-2016

EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI) (IEC 62433-4:2016); German version EN 62433-4:2016

BS EN 62228-2:2017 集成电路. 收发器EMC评估. LIN收发器

Integrated circuits. EMC evaluation of transceivers. LIN transceivers

IEC 60747-16-1:2001/AMD2:2017 半导体器件.第16-1部分:微波集成电路.放大器.修改件2

Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

IEC 60747-16-1:2017 半导体器件. 第16-1部分: 微波集成电路. 放大器

This part of IEC 60747 provides the terminology, the essential ratings and characteristics, as well as the measuring methods for integrated circuit microwave power amplifiers.

Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

IEC 62435-2:2017 电子元件. 电子半导体设备的长期储存. 第2部分: 劣化机制

This part of IEC 62435 is related to deterioration mechanisms and is concerned with the way that components degrade over time depending on the storage conditions applied. This part also includes guidance on test methods that may be used to assess generic deterioration mechanisms. Typically, this part is used in conjunction with IEC 62435-1 for any device long- term storage whose duration may be more than 12 months for product scheduled for long duration storage. Mechanisms that apply to specific component types are detailed in IEC 62435-5 to IEC 62435-9 (proposed).

Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms

IEC 62435-5:2017 电子元件. 电子半导体设备的长期储存. 第5部分: 晶粒和晶元设备

This part of IEC 62435, is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes. Typically, this part is used in conjunction with IEC 62435-1 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage.

Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices

BS EN 62433-4:2016 EMC IC建模. 用于RF抗干扰能力的行为模拟集成电路模型. 传导抗扰度建模(ICIM-CI)

EMC IC modelling. Models of integrated circuits for RF immunity behavioural simulation. Conducted immunity modelling (ICIM-CI)

BS IEC 63055:2016 大规模集成电路(LSI)封装电路板互操作设计格式

Format for LSI-Package-Board interoperable design

IEC 63055:2016 大规模集成电路(LSI)封装电路板互操作设计格式

This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI)@ b) packages for such LSI@ and c) printed circuit boards on which the packaged LSI are interconnected. Collectively@ such designs are referred to as?? LSI-Package-Board?? (LPB) designs. The format provides a common way to specify information/data about the project management@ netlists@ components@ design rules@ and geometries used in LPB designs

Format for LSI-Package-Board interoperable design

IEC 62228-2:2016 集成电路. 收发器EMC评估. 第2部分: LIN收发器

This part of IEC 62228 specifies test and measurement methods for EMC evaluation of LIN transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for standard LIN transceiver ICs and ICs with embedded LIN transceiver and covers the emission of RF disturbances; the immunity against RF disturbances; the immunity against impulses and; the immunity against electrostatic discharges (ESD).

Integrated circuits - EMC evaluation of transceivers - Part 2: LIN transceivers

DIN EN 62132-1:2016 集成电路.电磁辐射干扰测定.第1部分:一般条件和定义(IEC 62132-1-2015).德文版本EN 62132-1-2016

Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions (IEC 62132-1:2015); German version EN 62132-1:2016

BS EN 62132-1:2016 集成电路.电磁抗扰性的测量.通用条件和定义

Integrated circuits. Measurement of electromagnetic immunity. General conditions and definitions

SJ 21147.1-2016 军用集成电路电磁发射测量方法 第1部分：通用条件和定义

本部分规定了集成电路(IC)的传导和辐射电磁发射测量的通用信息和定义，还规定了试验条件、试验设备和配置、试验程序和试验报告等内容。附录A中给出了试验方法的对照表，以帮助选择适当的测量方法。 本部分适用于对受控条件下集成电路产生的辐射发射或传导发射的电压和电流的测量，以定量地获得集成电路应用过程中可能产生的射频(RF)干扰。

Measurement of electromagnetic emissions for military integrated circuits.Part 1: General conditions and definitions

SJ/T 11585-2016 串行存储器接口要求

Serial memory interface requirements

BS PD IEC/TR 61967-1-1:2015 集成电路.电磁辐射管理.第1-1部分:定义和一般条件.近似场扫描数据交换格式

Integrated circuits. Measurement of electromagnetic emissions. General conditions and definitions. Near-field scan data exchange format

DIN IEC/TS 61967-3:2015 集成电路. 电磁辐射的测量. 第3部分: 辐射发射的测量. 表面扫描法(IEC/TS 61967-3-2014)

Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method (IEC/TS 61967-3:2014)