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surface mount technology

surface mount technology, Total:106 items.

In the international standard classification, surface mount technology involves: Electronic components in general, Mechanical structures for electronic equipment, Electronic component assemblies, Packaging and distribution of goods in general, Environmental testing, Electrical engineering in general.

British Standards Institution (BSI), surface mount technology

BS EN 61760-1:2006 Surface mounting technology. Standard method for the specification of surface mounting components (SMDs)
BS EN IEC 61760-1:2020 Surface mounting technology - Standard method for the specification of surface mounting components (SMDs)
BS EN 61760-2:2007 Surface mounting technology - Transportation and storage conditions of surface mounting devices (SMD) - Application guide
BS EN 62137-1-3:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Cyclic drop test
BS EN 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Cyclic bending test
BS EN 62137-1-1:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Pull strength test
BS EN 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Shear strength test
BS EN 61760-4:2015+A1:2018 Surface mounting technology - Classification, packaging, labelling and handling of moisture sensitive devices
BS EN 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5:Mechanical shear fatigue test
BS 6221-22:1990 Printed wiring boards - Guide to the use of printed wiring board substrate materials: surface mount technology
BS EN 61760-4:2015 Surface mounting technology. Classification, packaging, labelling and handling of moisture sensitive devices
BS EN 61760-3:2010 Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering
PD IEC TR 61760-3-1:2022 Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

Korean Agency for Technology and Standards (KATS), surface mount technology

KS C IEC 61760-1-2007(2017) Surface mounting technology－Part 1：Standard method for the specification of surface mounting components(SMDs)
KS C IEC 61760-1:2007 Surface mounting technology－Part 1：Standard method for the specification of surface mounting components(SMDs)
KS C IEC 61760-1-2007(2022) Surface mounting technology－Part 1：Standard method for the specification of surface mounting components(SMDs)
KS C IEC 62137-1-1-2009(2020) Surface mounting technology－Environmental and endurance test methods for surface mount solder joint－Part 1－1：Pull strength test
KS C IEC 61760-2:2009 Surface mounting technology-Part 2:Transportation and storage conditions of surface mounting devices(SMD)-Application guide
KS C IEC 61760-2-2009(2020) Surface mounting technology－Part 2：Transportation and storage conditions of surface mounting devices(SMD)－Application guide
KS C IEC 62137-1-2-2009(2020) Surface mounting technology－Environmental and endurance test methods for surface mount solder joint－Part 1-2: Shear strength test
KS C IEC 62137-1-1:2009 Surface mounting technology－Environmental and endurance test methods for surface mount solder joint－Part 1－1：Pull strength test
KS C IEC 62137-1-2:2009 Surface mounting technology－Environmental and endurance test methods for surface mount solder joint－Part 1-2: Shear strength test

German Institute for Standardization, surface mount technology

DIN EN IEC 61760-1:2022-12 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2020); German version EN IEC 61760-1:2020 / Note: DIN EN 61760-1 (2006-10) remains valid alongside this standard until 2023-0...
DIN EN 62137-1-1:2008-02 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test (IEC 62137-1-1:2007); German version EN 62137-1-1:2007
DIN EN 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 61760-2:2007); German version EN 61760-2:2007
DIN EN 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006); German version EN 61760-1:2006
DIN EN 62137-1-2:2008-02 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test (IEC 62137-1-2:2007); German version EN 62137-1-2:2007
DIN EN 62137-1-3:2009-07 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008); German version EN 62137-1-3:2009
DIN EN 62137-1-4:2009-08 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009); German version EN 62137-1-4:2009
DIN EN 62137-1-1:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test (IEC 62137-1-1:2007); German version EN 62137-1-1:2007
DIN EN 62137-1-5:2010-01 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5: Mechanical shear fatigue test (IEC 62137-1-5:2009); German version EN 62137-1-5:2009
DIN EN 61760-4:2018-09 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (IEC 61760-4:2015 + A1:2018); German version EN 61760-4:2015 + A1:2018 / Note: DIN EN 61760-4 (2016-03) remains valid alongside this s...
DIN EN 62137-1-2:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test (IEC 62137-1-2:2007); German version EN 62137-1-2:2007
DIN EN 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009); German version EN 62137-1-4:2009
DIN EN 62137-1-3:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008); German version EN 62137-1-3:2009
DIN EN IEC 61760-3:2022-07 Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (IEC 61760-3:2021); German version EN IEC 61760-3:2021 / Note: DIN EN 61760-3 (2010-12) remains valid alongside this stand...
DIN EN 61760-4:2016 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (IEC 61760-4:2015); German version EN 61760-4:2015
DIN EN 61760-3:2010 Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010); German version EN 61760-3:2010

International Electrotechnical Commission (IEC), surface mount technology

IEC 61760-1:1998 Surface mounting technology - Part 1: Standard method for the specification for surface mounting components (SMDs)
IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 61760-2:2021 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
IEC 61760-2:2021 RLV Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
IEC 61760-2:1998 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
IEC 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface-mount solder joints - Part 1-4: Cyclic bending test
IEC 62137-1-3:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
IEC 62137-1-1:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
IEC 61760-4:2018 Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
IEC 61760-4:2015+AMD1:2018 CSV Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
IEC 61760-4:2015/AMD1:2018 Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
IEC 60068-2-69:1995 Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
IEC TR 61760-3-1:2022 Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surf

CENELEC - European Committee for Electrotechnical Standardization, surface mount technology

EN 61760-1:1998 Surface Mounting Technology Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
EN 61760-2:1998 Surface Mounting Technology Part 2: Transportation and Storage Conditions of Surface Mounting Devices (SMD) - Application Guide
EN 60068-2-69:1996 Environmental Testing Part 2: Tests Test Te: Solderability Testing of Electronic Components for Surface Mount Technology by the Wetting Balance Method

Association Francaise de Normalisation, surface mount technology

NF C90-710:1999 Surface mounting tehcnology - Part 1 : standard method for the specification of surface mounting components (SMDs).
NF C90-710-1*NF EN 61760-1:2014 Surface mounting technology - Part 1 : standard method for the specification of surface mounting components (SMDs)
NF C90-710-2*NF EN 61760-2:2014 Surface mounting technology - Part 2 : transportation and storage conditions of surface mounting devices (SMD) - Application guide
NF C93-704-1-3*NF EN 62137-1-3:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3 : cyclic drop test
NF C93-704-1-4*NF EN 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4 : cyclic bending test.
NF C93-704-1-1*NF EN 62137-1-1:2014 Surface-mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1 : pull strength test
NF C93-704-1-5*NF EN 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5 : mechanical shear fatigue test.
NF C93-704-1-2*NF EN 62137-1-2:2014 Surface-mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2 : shear strength test
NF C90-710-3*NF EN IEC 61760-3:2021 Surface mounting technology - Part 3 : standard method for the specification of components for through-hole reflow (THR) soldering
NF C90-710-3*NF EN 61760-3:2010 Surface mounting technology - Part 3 : standard method for the specification of components for Through Hole Reflow (THR) soldering.
NF C20-769:1998 Environmental testing. Part 2 : tests. Test Te : solderability testing of electronic components for surface mount technology by the wetting balance method.

European Committee for Electrotechnical Standardization（CENELEC）, surface mount technology

EN IEC 61760-1:2020 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
EN 61760-1:2006 Surface Mounting Technology Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
EN 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
EN 62137-1-1:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
EN 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
EN 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
EN IEC 61760-3:2021 Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
EN 60068-2-69:2007 Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
EN 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

ES-UNE, surface mount technology

UNE-EN 61760-1:2006 Surface mounting technology -- Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006) (Endorsed by AENOR in September of 2006.)
UNE-EN IEC 61760-1:2020 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (Endorsed by Asociación Española de Normalización in November of 2020.)
UNE-EN 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-4: Cyclic bending test (Endorsed by AENOR in May of 2009.)
UNE-EN 62137-1-3:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-3: Cyclic drop test (Endorsed by AENOR in May of 2009.)
UNE-EN 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints -- Part 1-5: Mechanical shear fatigue test (Endorsed by AENOR in August of 2009.)
UNE-EN 62137-1-1:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-1: Pull strength test (IEC 62137-1-1:2007). (Endorsed by AENOR in December of 2007.)
UNE-EN 61760-2:2007 Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 61760-2:2007). (Endorsed by AENOR in November of 2007.)
UNE-EN 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-2: Shear strength test (IEC 62137-1-2:2007). (Endorsed by AENOR in December of 2007.)
UNE-EN 61760-4:2015 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (Endorsed by AENOR in August of 2015.)
UNE-EN 61760-4:2015/A1:2018 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (Endorsed by Asociación Española de Normalización in June of 2018.)
UNE-EN 61760-3:2010 Surface mounting technology -- Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (Endorsed by AENOR in September of 2010.)
UNE-EN IEC 61760-3:2021 Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (Endorsed by Asociación Española de Normalización in April of 2021.)

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, surface mount technology

GB/T 19405.1-2003 Surface mounting technology-Part 1:Standard method for the specification of surface mounting components(SMDs)
GB/T 19405.2-2003 Surface mounting technology Part 2:Transportation and storage conditions of surface mounting devices(SMD)-Application guide

Danish Standards Foundation, surface mount technology

DS/EN 62137-1-1:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
DS/EN 62137-1-2:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
DS/EN 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

Japanese Industrial Standards Committee (JISC), surface mount technology

JIS C 5070:2002 Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) -- Application guide
JIS C 5070:2009 Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) -- Application guide
JIS C 62137-1-3:2011 Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-3: Cyclic drop test
JIS C 62137-1-4:2011 Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-4: Cyclic bending test
JIS C 62137-1-1:2010 Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-1: Pull strength test
JIS C 62137-1-2:2010 Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-2: Shear strength test
JIS C 62137-1-5:2011 Surface mounting technology -- Environmental and endurance test methods for surface mount solder joints -- Part 1-5: Mechanical shear fatigue test
JIS C 61760-4:2016 Surface mounting technology -- Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
JIS C 61760-3:2022 Surface mounting technology -- Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

Lithuanian Standards Office , surface mount technology

LST EN 62137-1-3-2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008)

未注明发布机构, surface mount technology

BS EN 61760-4:2015+A1:2018(2020) Surface mounting technology Part 4 : Classification, packaging, labelling and handling of moisture sensitive devices

Standard Association of Australia （SAA）, surface mount technology

AS 60068.2.69:2004 Environmental testing - Tests - Test Te: Soldering - Solderability testing of electronic components for surface mount technology by the wetting balance method

RU-GOST R, surface mount technology

GOST R 56427-2015 Soldering of electronic modules of radio-electronic means. Automated mixed and surface mounting using lead-free and conventional technology. Technical requirements for the implementation of technological operations